Proceedings
Conference proceeding would be published
by Key Engineering Materials. ISBN: 978-3-0357-1648-1 Vol. 1060
Online: https://www.scientific.net/MSF.1060
Index: Scopus
.
Keynote and Invite Speeches
This year, the conference invite three keynote speakers and three invite speakers. They are
Keynote Speech I |
Keynote Speech II |
Keynote Speech III |
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Prof. Zhongfan Liu, Peking University,
China Mass Production Technology of CVD Graphene Materials for
Setting the Cornerstone of Graphene Industry |
Prof. Alan Lau, Swinburne University of
Technology, Australia Aircraft Composite Repair - Fundamental to
Structural Health Monitoring |
Prof. Jong Hak Kim, Yonsei University,
South Korea Graft Copolymer for Membranes and Supercapacitors
|
Invite Speech I |
Invite Speech II |
Invite Speech III |
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Assoc. Prof. Teik-Cheng Lim, Singapore
University of Social Sciences, Singapore Mechanical
metamaterials with sign toggling properties |
Dr. Seok-Keun Koh, DaeMyung TS, South
Korea Antimicrobial Nanocomposites by the Nanoparticles on
Powder (NPP) Process and its Current Status |
Dr. Qiaoyuan Deng, Hainan University,
China Cu Ion Promote the Formation of Carbonaceous Films on the
Articulating Surface of Artificial Joints |
Winner of Best Presentation in 2022
R1004
Paper Title: Characterization of interfacial bonding properties of
Vitrimer epoxy/ T700 carbon fiber by microdrop test
Heshan Bai, Tianyu Zhao, Ruixiang Bai, Zhenkun Lei,
Chen Liu
Dalian University of Technology, China
R1028
Paper Title: Effective medium analysis of stacked-nanoparticles array’s
optical responses
Muhammad Tegar Pambudi, Priastuti Wulandari, Alexander
A. Iskandar
ITB, Indonesia
R1018-A
Paper Title: Simultaneously enhancing strength and ductility in graphene
nanoplatelets reinforced Ti6Al4V composites via selective laser melting
of core-shell powders
Weijia Ren, Mabao Liu, Wei Zhang
Xi’an Jiaotong University, China
R1004
Paper Title: Characterization of interfacial bonding properties of
Vitrimer epoxy/ T700 carbon fiber by microdrop test
Heshan Bai, Tianyu Zhao, Ruixiang Bai, Zhenkun Lei,
Chen Liu
Dalian University of Technology, China
More and original, please mail
iccbm@sciei.org.